TPAK copper clip single tube plastic package structure

A TPAK copper clip single-tube plastic package structure comprises a carrier layer, a TPAK device layer, a connecting layer and a cover plate. The carrier layer comprises a DBC upper copper layer, a first power terminal, a second power terminal, an emitter signal terminal and a gate signal terminal....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NING CHENYU, WU RUI, OU DONGYING, XU JIAHUI, ZHAO HUAYONG, TANG ZHUOFAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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