TPAK copper clip single tube plastic package structure

A TPAK copper clip single-tube plastic package structure comprises a carrier layer, a TPAK device layer, a connecting layer and a cover plate. The carrier layer comprises a DBC upper copper layer, a first power terminal, a second power terminal, an emitter signal terminal and a gate signal terminal. The connecting layer comprises a first connecting structure, a second connecting structure and a third connecting structure. Compared with the prior art, by arranging the connecting layer and adopting Cu-Clip connection, the current distribution is more uniform, the waveform of the signal terminal is more stable, and the service life and the reliability are prevented from being influenced by the falling of the bonding wire. And meanwhile, the first power terminal and the DBC upper copper layer which are integrally formed are arranged, so that the use of welding flux is reduced, the risk of welding flux failure is reduced, the chip layout space is enlarged, the influence of thermal coupling is reduced, and the resi