Wafer mounting equipment
The utility model provides a wafer mounting device, which comprises a module mounting part, an R-axis rotating motor, a Z-axis motor, a suction nozzle mounting part, a suction nozzle and a transmission mechanism, the R-axis rotating motor and the Z-axis motor are mounted on the module mounting part,...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The utility model provides a wafer mounting device, which comprises a module mounting part, an R-axis rotating motor, a Z-axis motor, a suction nozzle mounting part, a suction nozzle and a transmission mechanism, the R-axis rotating motor and the Z-axis motor are mounted on the module mounting part, the Z-axis motor is used for driving the suction nozzle mounting part to move longitudinally, and the suction nozzle mounting part is used for driving the suction nozzle to move longitudinally. The suction nozzle is connected with the suction nozzle mounting piece, and the R-axis rotating motor drives the suction nozzle to rotate through the transmission mechanism. The suction nozzle has the advantages that the R-axis rotary motor is arranged at the rear, rotary transmission of the suction nozzle is completed through the transmission mechanism, Z-direction sliding is allowed, and therefore Z-direction loads are reduced.
本实用新型提供了一种晶圆贴装设备，包括模块安装件、R轴旋转马达、Z轴马达、吸嘴安装件、吸嘴、传动机构，所述R轴旋转马达和所述Z轴马达安装在所述模块安装件上，所述Z轴马达用于驱动所述吸嘴安装件 |
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