Wafer material frame
The embodiment of the utility model provides a wafer material frame, the wafer material frame comprises an end plate and a contact rod, the end face of the end plate is provided with at least two groups of guide grooves, each group of guide grooves comprises two guide grooves which are arranged at i...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The embodiment of the utility model provides a wafer material frame, the wafer material frame comprises an end plate and a contact rod, the end face of the end plate is provided with at least two groups of guide grooves, each group of guide grooves comprises two guide grooves which are arranged at intervals along a first direction, and the two guide grooves extend along a second direction and are arranged in a relatively inclined manner. Wherein the two groups of guide grooves are arranged at intervals along a second direction, the second direction is orthogonal to the first direction, the two end plates are arranged at intervals along the thickness direction of the end plates, the guide grooves on the two end plates are arranged in one-to-one correspondence, and at least part of the contact rod is connected between the two end plates. And the end parts of the at least four contact rods are arranged in one-to-one correspondence with the two groups of guide grooves of the end plate at the corresponding end. Ac |
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