Water-cooling heat dissipation structure of electronic equipment and inverter with water-cooling heat dissipation structure

A water-cooling heat dissipation structure of electronic equipment is used for heat dissipation of a box body of the electronic equipment and comprises a heat dissipation body with a heat dissipation groove, the heat dissipation body comprises a bottom plate and a side plate, the bottom plate is pro...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIU HUANLAN, SONG YANMING, WEN XIKAI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:A water-cooling heat dissipation structure of electronic equipment is used for heat dissipation of a box body of the electronic equipment and comprises a heat dissipation body with a heat dissipation groove, the heat dissipation body comprises a bottom plate and a side plate, the bottom plate is provided with a water inlet and a water outlet, a partition plate is arranged in the heat dissipation groove, and the side plate is provided with a water inlet and a water outlet; the partition plate divides the heat dissipation groove into a heat dissipation path with the two ends communicated with the water inlet and the water outlet respectively, one end of the side plate is in sealed connection with the bottom plate, the other end of the side plate is fixed to one outer side face of the box body in a sealed mode, the front end of the partition plate is in sealed connection with the bottom plate, and the rear end of the partition plate is fixed to the outer side face of the box body. The water-cooling heat dissipat