Semiconductor reflow soldering equipment for PCB (Printed Circuit Board)

The utility model relates to the technical field of reflow soldering equipment, and discloses reflow soldering equipment for a PCB (Printed Circuit Board) semiconductor, which comprises a reflow soldering main box, a feeding conveying mechanism, a soldering conveying structure and a discharging conv...

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1. Verfasser: RAN HONGBIN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model relates to the technical field of reflow soldering equipment, and discloses reflow soldering equipment for a PCB (Printed Circuit Board) semiconductor, which comprises a reflow soldering main box, a feeding conveying mechanism, a soldering conveying structure and a discharging conveying structure are arranged in the reflow soldering main box from left to right, and two partition plates are fixedly connected to the inner wall of the lower part of the reflow soldering main box; the two partition plates are arranged on the feeding conveying mechanism, a heating assembly is arranged between the two partition plates, the top of the reflow soldering main box is fixedly connected with a shrinkage box, the top of the shrinkage box is fixedly connected with an electric push rod, and the end of a piston rod of the electric push rod is fixedly connected with a sealed thermal insulation gate. The partition plate and the sealed thermal insulation gate divide the welding area, so that when a circuit is fu