Efficient heat dissipation structure of fever cooling patch

The utility model relates to the field of fever cooling patches, in particular to an efficient heat dissipation structure of a fever cooling patch. The technical problem is that when heat flow is continuously accumulated below, the heat flow is not easy to discharge, so that the temperatures of the...

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Bibliographische Detailangaben
Hauptverfasser: HE GUANXI, LIN JIARONG, HE TIANGUANG, LI ZHIYI, HUANG SHUYAN, GAO YIEN, ZHONG TUDI
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The utility model relates to the field of fever cooling patches, in particular to an efficient heat dissipation structure of a fever cooling patch. The technical problem is that when heat flow is continuously accumulated below, the heat flow is not easy to discharge, so that the temperatures of the upper and lower layers of gel are different, and the overall heat dissipation effect is reduced. According to the technical scheme, the efficient heat dissipation structure of the fever cooling patch comprises a gel heat dissipation module, a sliding type heat dissipation gel module, a directional adhesion module and a fever cooling module; different from a single-layer gel layer for covering in the prior art, the gel heat dissipation module is additionally arranged, heat dissipation and cooling treatment on the outermost periphery can be formed, peripheral protection and bearing protection on an internal structure can be formed, heat flow gradually rises to enter an airflow space, airflow is in butt joint with a h