Device for testing suction vacuum value in chip packaging
The utility model discloses a device for testing a material suction vacuum value in chip packaging, which comprises a material suction box and a material suction mechanism, a chip packaging fixing mechanism is fixedly arranged in front of the inner wall of the material suction box, the material suct...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The utility model discloses a device for testing a material suction vacuum value in chip packaging, which comprises a material suction box and a material suction mechanism, a chip packaging fixing mechanism is fixedly arranged in front of the inner wall of the material suction box, the material suction mechanism is fixedly arranged above the outer wall of the material suction box, and the chip packaging fixing mechanism is fixedly arranged above the outer wall of the material suction box. A rotating mechanism capable of rotating and moving is arranged on one side of the upper portion of the outer wall of the material suction box, and a material suction reaction mechanism convenient to install is arranged on the lower portion of the inner wall of the material suction box. According to the device for testing the material suction vacuum value in chip packaging, the material suction mechanism is arranged, meanwhile, the material suction reaction mechanism is arranged in a matched mode, so that the material suctio |
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