Wafer electroplating pretreatment device

The utility model provides a wafer electroplating pretreatment device. The wafer electroplating pretreatment device comprises a water collecting tank, an upper cover unit, a spraying unit and a vacuumizing unit, during working, the upper cover unit is firstly lifted upwards, a wafer jig with a wafer is placed on the jig connecting shaft in the water collecting tank, and then the upper cover body descends to form sealing with the water collecting tank; then, the spraying unit is used for spraying and wetting the surface of the wafer, after wetting is conducted for a period of time, the spraying unit is closed, the upper cover body and the water collecting pool are vacuumized through the vacuumizing unit, unwetted air holes of the microstructure on the surface of the wafer are discharged, then the vacuumizing unit is closed, and the surface of the wafer is wetted through the spraying unit; the wetting efficiency of the wafer is remarkably improved through multiple cycles of wetting-vacuumizing exhaust, it is gu