Automatic film covering device for micro-fluidic chip

The utility model discloses an automatic film coating device for a micro-fluidic chip, which comprises a bottom plate, and a feeding frame, a discharging frame, a material taking assembly, a chip placing assembly, a stamping assembly and a driving assembly are arranged on the bottom plate, the material taking assembly is used for placing a to-be-laminated chip on the feeding frame on the chip placing assembly and placing the stamped and laminated chip on the discharging frame, the driving assembly is used for driving the chip placing assembly to move the to-be-laminated chip to the position below the stamping assembly, and the stamping assembly is used for stamping and laminating the to-be-laminated chip. The material taking assembly, a mechanical arm and a suction cup complete feeding and discharging of the chips, the chips are conveyed to the position below the stamping assembly through a rotary tray, and hot stamping pressure film covering operation of the chips is automatically completed. 本实用新型公开了一种用于微流控芯