Glue uniformizing device for wafer

The utility model discloses a wafer glue uniformizing device, which is characterized in that a glue uniformizing box body is provided with a feed port and a discharge port, and the glue uniformizing box body is provided with a feed door and a discharge door; the wafer feeding mechanism is used for feeding a wafer from a feeding hole; the wafer discharging mechanism is led out from the discharging opening; a bottom plate is fixed in the glue uniformizing box body, a main shaft lifting frame is installed on the bottom plate in a lifting mode, a main shaft is rotatably installed on the main shaft lifting frame, a main shaft lifting power device is arranged on the bottom plate, a negative pressure suction cup is fixed to the upper end of the main shaft, a negative pressure channel is formed in the center of the main shaft, and a rotating power device is installed on the main shaft lifting frame. An edge cleaning device and a back cleaning device are fixed on the glue uniformizing box body, a glue dripping shell i