Anti-desoldering Mini LED packaging structure

The utility model provides an anti-desoldering Mini LED packaging structure, and relates to the technical field of Mini LED packaging. Comprising a PCB and a Mini LED chip welded to the PCB, a dissoluble varnish layer is arranged outside the Mini LED chip, the varnish layer further covers the welding position of the Mini LED chip and the PCB, an adhesive layer is connected to the upper portion of the varnish layer and does not make contact with the PCB and the Mini LED chip, and a black film is connected to the upper portion of the adhesive layer; the LED chip and the PCB substrate can be stabilized through varnish, a large number of LEDs are prevented from being taken away during maintenance and film uncovering, and the repair yield is improved; and through paint removal, impurities are prevented from being introduced into the LED chip during welding of the residual glue, so that process defects are avoided, and the repair efficiency is improved. 本实用新型提出了一种防脱焊MiniLED封装结构，涉及MiniLED封装技术领域。包括：PCB板和焊接于PCB板的MiniL