Semiconductor structure for chemical plating test and wafer for chemical plating test

The utility model provides a semiconductor structure for chemical plating test and a wafer for chemical plating test. The semiconductor structure for the chemical plating test comprises a plurality of welding pad substrate layers, and each welding pad substrate layer is provided with a first surface and a second surface which deviate from each other; the plurality of welding pads are arranged on one side where the first surface of the substrate layer is located at intervals, and each welding pad is provided with a to-be-chemically-plated surface deviating from one side of the substrate layer; wherein the sizes of the surfaces, to be chemically plated, of at least two welding pads in the multiple welding pads are different, and/or the shapes of the surfaces, to be chemically plated, of at least two welding pads in the multiple welding pads are different. According to the semiconductor structure for the chemical plating test, machine testing requirements before production of semiconductor products corresponding