Dividing device and silicon wafer conveying system
The utility model discloses a separating device and a silicon wafer conveying system applying the separating device, the separating device comprises a feeding conveying belt, a plurality of discharging conveying belts, a transverse conveying assembly and an adsorption assembly, the plurality of disc...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a separating device and a silicon wafer conveying system applying the separating device, the separating device comprises a feeding conveying belt, a plurality of discharging conveying belts, a transverse conveying assembly and an adsorption assembly, the plurality of discharging conveying belts are uniformly arranged at intervals along the width direction of any one of the discharging conveying belts, and the transverse conveying assembly is arranged at intervals along the width direction of any one of the discharging conveying belts. The feeding conveying belt and any one of the multiple discharging conveying belts are oppositely arranged so as to be suitable for conveying workpieces to any one of the multiple discharging conveying belts. The transverse conveying assembly is arranged on the upper sides of the ends, close to the feeding conveying belt, of the discharging conveying belts, and the transverse conveying assembly extends in the arrangement direction of the multiple disc |
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