Discrete device heat dissipation device

The utility model discloses a discrete device heat dissipation device, and relates to the technical field of semiconductors. Comprising an upper packaging shell and a lower packaging shell, a discrete device body is inserted between the upper packaging shell and the lower packaging shell, one end of...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SUN MINGGUANG, HAN MINGHUI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model discloses a discrete device heat dissipation device, and relates to the technical field of semiconductors. Comprising an upper packaging shell and a lower packaging shell, a discrete device body is inserted between the upper packaging shell and the lower packaging shell, one end of the upper packaging shell and one end of the lower packaging shell are provided with a fixing mechanism, and the fixing mechanism comprises fixing plates fixed to one end of the upper packaging shell and one end of the lower packaging shell respectively. Compared with the prior art, the discrete device is characterized in that the lifting block is lifted upwards, so that the moving plate and the limiting plate move upwards, the spring is stretched, the plug bush slides in the socket piece, the limiting plate does not shield the discrete device any more, then the discrete device body can be inserted into the upper packaging shell and the lower packaging shell, then the lifting block is loosened, and the spring rest