Wafer thickness measuring device of thinning machine

The utility model discloses a wafer thickness measuring device of a thinning machine. The wafer thickness measuring device comprises a wafer grabbing device, a wafer lateral clamping mechanism, an X-direction moving mechanism, a Y-direction moving mechanism, a machine table, a C-shaped support, a first laser range finder and a second laser range finder. The wafer grabbing device is used for grabbing a wafer to the wafer lateral clamping mechanism, and the wafer lateral clamping mechanism clamps the wafer from the side edge of the wafer; the X-direction moving mechanism and the Y-direction moving mechanism are used for moving; the C-shaped support is fixedly installed on the machine table, the opening direction of the C-shaped support faces the wafer lateral clamping mechanism, the first laser range finder and the second laser range finder are installed at the upper end and the lower end of the opening of the C-shaped support respectively, and the first laser range finder and the second laser range finder are