Circuit board structure facilitating heat dissipation of vehicle-mounted display screen

The utility model provides a circuit board structure facilitating heat dissipation of a vehicle-mounted display screen, which comprises a first printed circuit board used for installing an LED light source, and a second printed circuit board electrically connected with the first printed circuit boar...

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Bibliographische Detailangaben
Hauptverfasser:	WEI WEIYAN, YANG FAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS PRINTED CIRCUITS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	The utility model provides a circuit board structure facilitating heat dissipation of a vehicle-mounted display screen, which comprises a first printed circuit board used for installing an LED light source, and a second printed circuit board electrically connected with the first printed circuit board and used for installing a driving chip is arranged on the first printed circuit board. The first printed circuit board is of a single layer, and the second printed circuit board is of a multi-layer structure. The driving chip is independently mounted on the second printed circuit board, the LED lamp source is arranged on the first printed circuit board, and the first printed circuit board is connected with the second printed circuit board, so that the first printed circuit board for mounting the LED lamp source is of a single layer, and a bottom-layer base material of the single-layer board can be made of a material with better heat dissipation performance; therefore, the heat generated by the LED can be dissipat