Discrete semiconductor device bonding machine

The utility model discloses a semiconductor discrete device bonding machine which comprises a base, the upper side of the base is fixedly connected with a main body and a processing table, the processing table is located on the right side of the main body, the processing table is provided with a sliding groove, a threaded rod is rotatably connected in the sliding groove, the threaded rod is in threaded connection with a moving block, and the moving block is in sliding connection with the sliding groove. The front end of the threaded rod is fixedly connected with an adjusting knob, the adjusting knob is located on the front side of the machining table, the two sides of the machining table are slidably connected with pushing plates, the pushing plates are U-shaped, the upper ends of the pushing plates are fixedly connected with clamping plates, tension springs are fixedly connected between the sides, opposite to the machining table, in the pushing plates, the clamping plates are L-shaped, and the opposite sides