Liquid cooling heat dissipation device
The utility model belongs to the field of heat dissipation devices, and provides a liquid cooling heat dissipation device which comprises a heat conduction plate used for being connected with a heat source, an installation groove is formed in the upper end of the heat conduction plate, and the two s...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model belongs to the field of heat dissipation devices, and provides a liquid cooling heat dissipation device which comprises a heat conduction plate used for being connected with a heat source, an installation groove is formed in the upper end of the heat conduction plate, and the two sides of the installation groove extend outwards to form a plurality of clamping grooves which are symmetrically distributed and communicated with the installation groove. The copper plates are arranged in the mounting groove at intervals, and the two ends of each copper plate in the length direction are inserted into the clamping grooves so as to limit the movement of the copper plates relative to the heat conducting plate; a plurality of micro-channels for cooling liquid to circulate are formed in each copper plate; and the cover plate covers the heat conducting plate and the plurality of copper plates and is used for hermetically connecting two adjacent copper plates. Compared with the prior art, the utility mode |
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