Semiconductor wafer cutting machine

The utility model provides a semiconductor wafer cutting machine, which relates to the technical field of semiconductor wafers and comprises a placing seat, a vertical frame fixedly connected to the side end of the placing seat, a mounting groove arranged on the side surface of the vertical frame, a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TIAN MEIYI, LI ZHE, SUN YUNZHEN, SU XUNQI, TIAN YUAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The utility model provides a semiconductor wafer cutting machine, which relates to the technical field of semiconductor wafers and comprises a placing seat, a vertical frame fixedly connected to the side end of the placing seat, a mounting groove arranged on the side surface of the vertical frame, a sliding guide column arranged in the mounting groove, and a supporting framework slidably connected to the outside of the sliding guide column. Under the cooperation of the self-adjusting assembly, the whole device does not need other additional adjustment when semiconductor wafer cutting operation is conducted, the machining time efficiency is reduced, the operation efficiency is improved, and under the cooperation of the positioning rod, the adjusting transverse threaded rod and the adjusting motor, the machining efficiency is improved, and the machining efficiency is improved. The wafer cutting machine can be conveniently driven by the cutting mounting base to be adjusted at the bottom of the electric linear gu