Wafer film coating cutting machine

The utility model provides a wafer film coating cutting machine, which relates to the technical field of wafers and comprises an integral structure and an equipment component, and the integral structure is positioned on the outer surface of one side of the equipment component; the overall structure comprises a box body and a clamping seat, pressing plates are slidably connected to the positions, close to the top, of the front inner surface and the rear inner surface of the box body, and threaded rods are rotatably connected to the front position and the rear position of the inner bottom of the box body. When the second belt pulley can rotate, the belt body is stressed to drive the first belt pulley to rotate, then the threaded rod is driven together, so that the pressing plate can slide up and down in the box body, and when the pressing plate descends to a certain position, leftover materials can be extruded; more leftover materials can be contained in the box body, and the situation that a user needs to freq