Case with heat dissipation device

The utility model discloses a case with a heat dissipation device, and belongs to the field of heat dissipation devices. A cooling chamber and a heat dissipation chamber are formed in the case; the cooling chamber is used for placing a high-temperature electronic component main body to be cooled; the heat dissipation device comprises a condensation piece, a conveying piece and a pump body. The conveying piece is at least partially located in the heat dissipation cavity; the cooling cavity is used for being filled with non-conductive liquid; the conveying part is used for forming a circulating pipeline; the pump body is used for conveying non-conductive liquid in the circulating pipeline; the condensation part is used for cooling the conveying part located in the heat dissipation cavity. The electronic component has the beneficial effects that the electronic component main body is directly arranged in the box body filled with the non-conductive liquid, and then the non-conductive liquid is cooled, so that the