Semiconductor device

The semiconductor device includes a bottom semiconductor die including a bottom semiconductor die sidewall; a top semiconductor die bonded to the bottom semiconductor die and including a top semiconductor die sidewall; and a molding material layer formed over the upper surface of the bottom semiconductor die, over the sidewalls of the top semiconductor die, and over the sidewalls of the bottom semiconductor die. 半导体装置包括底部半导体晶粒，含有底部半导体晶粒侧壁；顶部半导体晶粒，接合至底部半导体晶粒，并含有顶部半导体晶粒侧壁；以及成型材料层，形成于底部半导体晶粒的上表面之上、顶部半导体晶粒侧壁之上、与底部半导体晶粒侧壁之上。