Packaging structure of pressure sensor

The utility model discloses a packaging structure of a pressure sensor, which relates to the technical field of sensor packaging and comprises a PCB (printed circuit board) wiring layer, an MEMS (micro-electromechanical system) silicon-based pressure sensor chip and an ASIC (application specific integrated circuit) conditioning chip. The inner bottom of the enclosure part is spaced from the MEMS silicon-based pressure sensor chip and the ASIC conditioning chip, the enclosure part is filled with silica gel and solidified, the top of the enclosure part is covered with a PCB cover plate, and the enclosure part is used for being fixedly connected with the connecting end faces of the PCB cover plate and the PCB wiring layer in a sealed mode; on the premise that the performance of the sensor is not affected, the ASIC conditioning chip is added, the testing precision is improved, the whole enclosure type sealing can be applied to pressure measurement of high-humidity and corrosive gas, different output requirements