Microstrip-to-waveguide structure

The utility model provides a microstrip-to-waveguide structure, which is characterized in that the microstrip-to-waveguide structure comprises a packaging substrate, the packaging substrate comprises an upper layer substrate and a lower layer substrate, the upper layer substrate comprises one or more layers of substrates, and a metal layer is laid on the top surface of the upper layer substrate; the first group of via holes penetrate through the packaging substrate and are tightly arranged in a circle, the hole wall gap between the first group of via holes is smaller than one eighth of the working wavelength, and the part, surrounding the packaging substrate, of the first group of via holes forms a dielectric cavity without a metal layer; and the microstrip-to-waveguide probe is arranged on the lower substrate, and a part of the microstrip-to-waveguide probe is arranged in the dielectric cavity. The microstrip waveguide structure provided by the embodiment of the utility model realizes higher precision and re