Communication type buried copper plate for improving blistering at edge of copper block

The utility model relates to the technical field of printed circuit boards, in particular to a communication type buried copper plate capable of improving bubbling at the edge of a copper block, which comprises a buried copper plate body and the copper block arranged in a core plate milling groove of the buried copper plate body, a copper plating layer is arranged on the surface of the buried copper plate body, and a patterned bonding pad area is arranged at the edge of the copper plating layer close to the copper block. The patterned bonding pad area is an area formed by outwards extending a core board milling groove forming line by 1.8 mm, patterned bonding pad units are arranged in the patterned bonding pad area along the core board milling groove forming line in a windowing mode, and each patterned bonding pad unit is composed of patterned bonding pads which are evenly distributed at equal intervals. According to the utility model, through the design of adding the patterned bonding pad at the edge of the