Multi-layer PCB circuit board structure
The utility model belongs to the technical field of PCBs (printed circuit boards), in particular to a multi-layer PCB structure, which comprises a PCB main body, an insulating frame layer and a mounting bottom plate layer, the PCB main body, the insulating frame layer and the mounting bottom plate l...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The utility model belongs to the technical field of PCBs (printed circuit boards), in particular to a multi-layer PCB structure, which comprises a PCB main body, an insulating frame layer and a mounting bottom plate layer, the PCB main body, the insulating frame layer and the mounting bottom plate layer are sequentially arranged from top to bottom, the side edges of the PCB main body, the insulating frame layer and the mounting bottom plate layer are respectively provided with a rectangular notch, and the rectangular notches are communicated with the mounting bottom plate layer. According to the utility model, through the arrangement of the dismounting mechanism, the PCB main body, the insulating frame layer and the mounting bottom plate layer have a more convenient dismounting effect, so that the PCB main body, the insulating frame layer and the mounting bottom plate layer can be more rapidly dismounted after a local fault occurs, and no tool is needed during the dismounting process, so that the dismounting |
---|