Axial heat dissipation diode

The utility model discloses an axial radiating diode and relates to a semiconductor power device. Comprising an anode lead, a chip, a cathode lead and an upper plastic package body, wherein a nail head of the anode lead is connected with the chip through a soldering lug; the LED lamp further comprises a metal heat dissipation base, the top of the metal heat dissipation base is provided with a big-end-down stepped annular groove, the chip is connected to the middle of the top of the metal heat dissipation base through a soldering lug, and the chip is located in the middle of the annular groove. The upper plastic package body is used for plastic package of the chip and the nail head of the positive electrode lead and extends into the annular groove; the bottom of the metal heat dissipation base is used for being connected with a negative electrode lead. In the working process, the positive electrode lead is firstly connected with the chip, and then the chip is connected with the metal heat dissipation base; as