Semiconductor structure

The semiconductor structure provided by the embodiment of the utility model comprises a first semiconductor tube core, a second semiconductor tube core, a top metal region, one or more dielectric layers and one or more copper welding pads. The second semiconductor die is bonded to the first semiconductor die such that the first semiconductor die and the second semiconductor die are vertically arranged in the semiconductor structure. The top metal region is on the second semiconductor die. The one or more dielectric layers are on the top metal region. The one or more copper pads are in the one or more dielectric layers. 本实用新型实施例的一种半导体结构包括第一半导体管芯、第二半导体管芯、顶部金属区域、一个或多个介电层以及一个或多个铜焊垫。所述第二半导体管芯与所述第一半导体管芯接合，使得所述第一半导体管芯和所述第二半导体管芯垂直布置在所述半导体结构中。所述顶部金属区域位于所述第二半导体管芯上。所述一个或多个介电层位于所述顶部金属区域上。所述一个或多个铜焊垫在所述一个或多个介电层中。