Deposition tool

The embodiment of the utility model provides a deposition tool. The deposition tool comprises a magnet assembly, a single cathode and a power supply circuit, wherein the power supply circuit is used for biasing a base for supporting a semiconductor substrate; during a deposition operation of depositing an inert metal material, the deposition tool may modulate an electromagnetic field emanating from a magnet assembly including a helical frequency band having different ranges of magnetic field strengths. The deposition tool may have an increased output relative to a physical vapor deposition tool without a magnet assembly, a single cathode, and a power supply circuit. The inert metal material may have a grain size greater than that of the inert metal material deposited without using the magnet assembly, the single cathode, and the power supply circuit. 本实用新型的实施例提供一种沉积工具包含磁体组件、单个阴极以及用于使支撑半导体衬底的底座偏压的电源电路。在沉积惰性金属材料的沉积操作期间，沉积工具可调变自包含具有不同磁场强度范围的螺旋形频带的磁体组件发出的电磁场。沉积工具可具有相对于没有磁体组件、单个阴极以及电源电路的物理气相沉积工具增加的产出量。惰性金属材料可具有相对于