Semiconductor device and micro-electro-mechanical system

The utility model relates to a semiconductor device and a micro-electro-mechanical system. A semiconductor device includes: a first die integrated with an electronic component; a second die bonded to the first die and forming a patterned structure, the first die having a major surface; an internal electrical coupling structure electrically coupling the major surface of the first die to the second die; an external connection region on the main surface of the first die; and a package that encapsulates the first die, the second die, and the internal electrical coupling structure and partially surrounds the external connection region, the external connection region partially protruding from the package. According to the embodiment of the invention, the final device is low in cost and good in control. Therefore, the final device has relatively low cost. 本公开涉及半导体器件和微机电系统。一种半导体器件，包括：第一管芯，集成电子元件；第二管芯，结合到所述第一管芯并且形成图案化结构，所述第一管芯具有主表面；内部电耦合结构，将所述第一管芯的所述主表面电耦合到所述第二管芯；外部连接区域，在所述第一管芯的所述主表面上；以及封装件，所述封装件封装所述第一管芯、所述第二管芯和所述内部电耦