Ejection structure for preventing excessive glue or lack of glue during demolding of thin and narrow product
The utility model discloses an ejection structure for preventing excessive glue or lack of glue during demoulding of a thin and narrow product. The ejection structure comprises a lower mould plate and a lower mould core arranged in the lower mould plate, a cavity is formed in the surface of the lowe...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses an ejection structure for preventing excessive glue or lack of glue during demoulding of a thin and narrow product. The ejection structure comprises a lower mould plate and a lower mould core arranged in the lower mould plate, a cavity is formed in the surface of the lower mold core, a plurality of spring receding holes are formed in the lower mold core, the spring receding holes are connected with coaxially-penetrating insert pin holes, insert pins movably extending to the cavity are arranged in the insert pin holes, springs limited in the spring receding holes are arranged outside the insert pins in a sleeving mode, and the spring receding holes are connected with the spring receding holes in a sleeving mode. A positioning block for supporting the insert pin is embedded in the surface of the lower mold plate, and an ejector pin which penetrates through the positioning block and movably abuts against the insert pin is arranged in the lower mold plate. According to the utility mode |
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