High-power planar junction bidirectional TVS diode chip

The utility model discloses a high-power planar junction bidirectional TVS diode chip, which belongs to the field of semiconductor technology research, and comprises a fixed plate, a heat dissipation mechanism of the high-power planar junction bidirectional TVS diode chip is arranged in the fixed plate, and the heat dissipation mechanism comprises a diode chip, a chip groove, a limiting block, a rubber pad, a spring, a heat conduction sheet, a heat dissipation sheet and an adjusting bolt. The heat dissipation mechanism is arranged to dissipate heat of the chip, the use effect of the chip is improved, and the diode chip is placed in the chip groove in the fixing plate, so that the diode chip is clamped and fixed through the limiting blocks on the periphery, that is, the diode chip can be used by extruding the spring to be clamped into the chip groove and restoring the elastic force of the spring for clamping. As the power of the chip is large, large heat can be generated in the using process, the heat is trans