Three-dimensional semiconductor packaging structure

The utility model provides a three-dimensional semiconductor packaging structure, which comprises pins, a base island, wafers and conductive metal wires for bonding and connecting the wafers and the pins, and at least one wafer is respectively fixed on the front surface and the back surface of the base island. According to the three-dimensional semiconductor packaging structure provided by the utility model, the wafers are respectively fixed on the front surface and the back surface of the base island, so that the three-dimensional packaging effect of the semiconductor packaging structure is achieved, and the small size and low material cost of the packaging structure can be effectively ensured. 本实用新型提供一种立体的半导体封装结构，包括引脚、基岛、晶圆、键合连接晶圆和引脚的导电金属线，基岛的正面和背面分别固定有至少一个所述晶圆。本实用新型提供的立体的半导体封装结构，通过在基岛正面和背面分别固定晶圆，达到半导体封装结构的立体封装效果，能够有效保证封装结构的小体积和低材料成本。