TO-263 lead frame

The utility model belongs to the technical field of semiconductor packaging, and particularly relates to a TO-263 lead frame, which comprises an upper frame, a lower frame, a plastic package body, a first pin, a second pin and a drain electrode, the upper frame is arranged at the top end of the plastic package body, a chip can be welded in the plastic package body, the plastic package body is connected with the first pin and the second pin through a connecting piece, the other end of the first pin and the other end of the second pin extend out of the plastic package body and are connected with the lower frame, and a drain electrode is arranged on the back of the plastic package body. The TO-263 lead frame provided by the utility model can effectively avoid the problem of voltage creepage under high voltage, and is beneficial to improving the electrical performance of a packaged product and guaranteeing the safety of the packaged product. 本实用新型属于半导体封装技术领域，具体涉及一种TO-263引线框架，包括上边框、下边框、塑封体、第一引脚、第二引脚和漏极；所述上边框设置在所述塑