Liquid glue potting IC packaging structure

The utility model provides a liquid glue potting IC packaging structure, which comprises a frame, a base island, pins, a wafer, a lead and plastic packaging glue, the base island, the pins, the wafer, the lead and the plastic packaging glue are integrally formed on the frame, the plastic packaging glue is fixedly connected with the base island and the pins in an injection molding manner, the wafer is bonded on the surface of the base island through heat-conducting glue, the lead is connected with the wafer and the pins in a bonding manner, and the lead and the plastic packaging glue are integrally formed on the frame. And liquid glue for sealing the wafer and the surface of the base island is encapsulated and cured in plastic packaging glue openings formed in the periphery of the base island in an injection molding manner. According to the liquid glue potting IC packaging structure provided by the utility model, the liquid glue is utilized to potting the wafer and the base island so as to form the liquid seal