Connecting device
The utility model provides a connecting device, which is used for connecting a transmission module and a process module in a wafer processing system, and comprises a connecting main body and a plugging mechanism, a conveying channel is formed in the connecting main body, and the conveying channel is...
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creator | ZENG PEIQIN WANG XIANG |
description | The utility model provides a connecting device, which is used for connecting a transmission module and a process module in a wafer processing system, and comprises a connecting main body and a plugging mechanism, a conveying channel is formed in the connecting main body, and the conveying channel is used for communicating the transmission module with the process module; the blocking mechanism is detachably connected with the connecting main body, and the blocking mechanism is used for closing or opening the conveying channel. In the embodiment of the invention, the transmission module and the process module are connected by using the connecting main body, and the blocking mechanism is arranged on the connecting main body, so that the function switching of communication or closing between the transmission module and the process module is realized, the installation and maintenance of the blocking mechanism are facilitated, and the cost is reduced. Besides, the connecting device is additionally arranged between |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN221427687UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN221427687UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN221427687UU3</originalsourceid><addsrcrecordid>eNrjZBB0zs_LS00uycxLV0hJLctMTuVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkZGhiZG5mYW5qGhxkQpAgAU8yBy</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Connecting device</title><source>esp@cenet</source><creator>ZENG PEIQIN ; WANG XIANG</creator><creatorcontrib>ZENG PEIQIN ; WANG XIANG</creatorcontrib><description>The utility model provides a connecting device, which is used for connecting a transmission module and a process module in a wafer processing system, and comprises a connecting main body and a plugging mechanism, a conveying channel is formed in the connecting main body, and the conveying channel is used for communicating the transmission module with the process module; the blocking mechanism is detachably connected with the connecting main body, and the blocking mechanism is used for closing or opening the conveying channel. In the embodiment of the invention, the transmission module and the process module are connected by using the connecting main body, and the blocking mechanism is arranged on the connecting main body, so that the function switching of communication or closing between the transmission module and the process module is realized, the installation and maintenance of the blocking mechanism are facilitated, and the cost is reduced. Besides, the connecting device is additionally arranged between</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240726&DB=EPODOC&CC=CN&NR=221427687U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240726&DB=EPODOC&CC=CN&NR=221427687U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZENG PEIQIN</creatorcontrib><creatorcontrib>WANG XIANG</creatorcontrib><title>Connecting device</title><description>The utility model provides a connecting device, which is used for connecting a transmission module and a process module in a wafer processing system, and comprises a connecting main body and a plugging mechanism, a conveying channel is formed in the connecting main body, and the conveying channel is used for communicating the transmission module with the process module; the blocking mechanism is detachably connected with the connecting main body, and the blocking mechanism is used for closing or opening the conveying channel. In the embodiment of the invention, the transmission module and the process module are connected by using the connecting main body, and the blocking mechanism is arranged on the connecting main body, so that the function switching of communication or closing between the transmission module and the process module is realized, the installation and maintenance of the blocking mechanism are facilitated, and the cost is reduced. Besides, the connecting device is additionally arranged between</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBB0zs_LS00uycxLV0hJLctMTuVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkZGhiZG5mYW5qGhxkQpAgAU8yBy</recordid><startdate>20240726</startdate><enddate>20240726</enddate><creator>ZENG PEIQIN</creator><creator>WANG XIANG</creator><scope>EVB</scope></search><sort><creationdate>20240726</creationdate><title>Connecting device</title><author>ZENG PEIQIN ; WANG XIANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN221427687UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>ZENG PEIQIN</creatorcontrib><creatorcontrib>WANG XIANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZENG PEIQIN</au><au>WANG XIANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Connecting device</title><date>2024-07-26</date><risdate>2024</risdate><abstract>The utility model provides a connecting device, which is used for connecting a transmission module and a process module in a wafer processing system, and comprises a connecting main body and a plugging mechanism, a conveying channel is formed in the connecting main body, and the conveying channel is used for communicating the transmission module with the process module; the blocking mechanism is detachably connected with the connecting main body, and the blocking mechanism is used for closing or opening the conveying channel. In the embodiment of the invention, the transmission module and the process module are connected by using the connecting main body, and the blocking mechanism is arranged on the connecting main body, so that the function switching of communication or closing between the transmission module and the process module is realized, the installation and maintenance of the blocking mechanism are facilitated, and the cost is reduced. Besides, the connecting device is additionally arranged between</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Connecting device |
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