Electronic device

The application provides an electronic device, comprising: a circuit board, which is provided with at least one heating assembly; the middle frame comprises a first part, the first part comprises a soaking piece, and the soaking piece is at least partially in thermal contact with the heating assembly in the direction perpendicular to the plane where the middle frame is located; the shielding part comprises a first shielding part, the first shielding part is located on the periphery of the heating assembly, a first shielding space is formed by the first shielding part, the part, including the soaking part, of the middle frame and the circuit board, and the heating assembly is located in the first shielding space. 本申请提供了一种电子设备，包括：电路板，所述电路板上具有至少一个发热组件；中框，所述中框包括第一部分，所述第一部分包括均热件，在垂直于所述中框所在平面的方向上，所述均热件与所述发热组件至少部分热接触；屏蔽件，所述屏蔽件包括第一屏蔽件，所述第一屏蔽件位于所述发热组件四周，与包括所述均热件在内的部分所述中框、所述电路板形成第一屏蔽空间，所述发热组件位于所述第一屏蔽空间内。