Low-pressure injection molding device

The utility model discloses a low-pressure injection molding device which comprises a base, and a driving pump set, a glue feeding mechanism and a glue injection mechanism which are sequentially connected, and a glue injection mold is arranged on one side, far away from the glue feeding mechanism, o...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LI HANWEI, CHEN BINGQING, SHAO WEIMING, YANG YONGKUAN, YANG FENG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model discloses a low-pressure injection molding device which comprises a base, and a driving pump set, a glue feeding mechanism and a glue injection mechanism which are sequentially connected, and a glue injection mold is arranged on one side, far away from the glue feeding mechanism, of the glue injection mechanism; the glue feeding mechanism comprises a glue feeding seat and a glue melting cylinder, a glue feeding hole is formed in the bottom of the glue melting cylinder, and a glue feeding channel correspondingly communicated with the glue feeding hole is formed in the glue feeding seat; the glue injection mold comprises an upper mold and a lower mold, and a glue injection channel and a cavity which are communicated with each other are formed between the upper mold and the lower mold; the glue injection mechanism comprises a fixed seat, a glue inlet pipe and a glue injection head, the glue inlet pipe is communicated with the glue inlet channel, a switching valve is arranged between the glue in