Probe card butt joint structure for wafer test

The utility model discloses a probe card butt joint structure for wafer testing, which belongs to the technical field of wafer testing and comprises a testing head and a wafer chuck, a wafer body is arranged on the wafer chuck, a butt joint mechanism is arranged at the bottom of the testing head, a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHO KYU-DAE, SONG XIULIANG, PARK YOUNG DOO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!