Probe card butt joint structure for wafer test

The utility model discloses a probe card butt joint structure for wafer testing, which belongs to the technical field of wafer testing and comprises a testing head and a wafer chuck, a wafer body is arranged on the wafer chuck, a butt joint mechanism is arranged at the bottom of the testing head, a probe card is fixed at the bottom of the butt joint mechanism, and the probe card is fixed at the bottom of the butt joint mechanism. The butt joint mechanism comprises a mounting plate and a plurality of air cylinders, a circular mounting hole is formed in the mounting plate, a plurality of spherical pistons are arranged in the mounting hole, and piston rods of the air cylinders are connected with the spherical pistons respectively; according to the utility model, the probe card is safely and reliably fixed when the card is loaded or unloaded, so that the probe card is connected with a wafer, and the wafer is stably tested. 本实用新型公开了一种用于晶圆测试的探针卡对接结构，属于晶圆测试技术领域，包括测试头和晶圆卡盘，所述晶圆卡盘上设置有晶圆本体，所述测试头的底部设有对接机构，所述对接机构的底部固定有探针