CCGA tin column forming device

The utility model relates to the technical field of electronic-grade lead-free solder manufacturing, and discloses a CCGA tin column forming device which comprises a forming frame, a supporting column and a clamping plate, a replacing device is arranged on the surface of the forming frame and compri...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: GUO YUANBIN, SHEN QIANYOU, SHEN LING
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!