CCGA tin column forming device

The utility model relates to the technical field of electronic-grade lead-free solder manufacturing, and discloses a CCGA tin column forming device which comprises a forming frame, a supporting column and a clamping plate, a replacing device is arranged on the surface of the forming frame and compri...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: GUO YUANBIN, SHEN QIANYOU, SHEN LING
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model relates to the technical field of electronic-grade lead-free solder manufacturing, and discloses a CCGA tin column forming device which comprises a forming frame, a supporting column and a clamping plate, a replacing device is arranged on the surface of the forming frame and comprises a sliding plate, a sliding groove is formed in the inner wall of the forming frame, the sliding plate is connected to the inner wall of the sliding groove in a sliding mode, and a handle is connected to the surface of the sliding plate. The surface of the sliding groove is connected with a first telescopic rod, the other end of the first telescopic rod is connected with the surface of the sliding plate, the surface of the forming frame is connected with an extending plate, and the surface of the extending plate is in threaded connection with a bolt. A guide block is connected to the surface of the forming frame, and the cross section of the guide block is triangular. The utility model solves the problem that th