Power module

There is provided a power module (10) comprising a substrate (2), an electronic component (3) and an electrical connection (4) wherein the power module further comprises a first connection layer (5B) and a second connection layer (5C). The substrate (2) has a first metallization layer (21) and a second metallization layer (22) which is spatially separated from the first metallization layer (21) by a separation trench (2T). The first connection layer (5B) is formed between the substrate (2) and the electronic component (3) in the vertical direction. The electronic component (3) is a semiconductor chip and is electrically and thermally connected to the first metallization layer (21) through a first connection layer (5B) as a patterned sintered connection layer that forms a sintered connection between the substrate (2) and the electronic component (3). In a top view, the region (50) of the sintered connection is partially covered by a sintered material, and the uncovered sub-region (50U) is delimited by one or s