Semiconductor device pin positioning and bending mechanism

The utility model relates to the technical field of semiconductor production, in particular to a semiconductor device pin positioning and bending mechanism which comprises a base, a semiconductor device carrying table is arranged at the top of the base, a semiconductor device is arranged at the top of the semiconductor device carrying table, pins are evenly distributed on one side of the semiconductor device, and the pins are arranged on the other side of the semiconductor device. The semiconductor device carrying table is provided with a pin positioning check block used for placing pins, the top of the base is fixedly connected with a supporting plate, and a bending head and a fixed pressing plate are arranged below the supporting plate. During use, when the mounting block at the bottom of the pin positioning stop block is inserted into the mounting groove, the mounting block can extrude the inclined surface and control the sliding block to move towards the interior of the sliding groove to extrude the sprin