Overcurrent protection device

The utility model provides an over-current protection device, which relates to the technical field of electronic devices and comprises a positive temperature coefficient chip set, the lower electrode of the positive temperature coefficient chip set is divided into a first lower electrode and a second lower electrode which are not communicated, and the second lower electrode is electrically connected with the upper electrode of the positive temperature coefficient chip set; and the at least two conductive bonding pads are located on the bottom surface of the positive temperature coefficient chip set, the conductive bonding pads are attached to the sealing shell on the lower surfaces of the first lower electrode and the second lower electrode respectively, the positive temperature coefficient chip set and the conductive bonding pads are packaged in the sealing shell, and only the lower surfaces of the conductive bonding pads are exposed. The beneficial effects are that a welding pad on one surface is cancelled,