Wafer cutting device capable of adjusting cutting width

The utility model provides a wafer cutting device capable of adjusting cutting width, which relates to the technical field of wafer cutting equipment, and comprises a base, the top of the base is fixedly connected with a fixed seat, a movable groove is arranged in the fixed seat, and the movable groove is fixed through the cooperation of the fixed seat, a connecting plate, a rotating groove, a fixed block, a threaded rod, a second motor and a sliding block. According to the wafer clamping device, a sliding block can move on the outer surface wall of a threaded rod, then wafers of different sizes can be stably clamped through cooperation of a first telescopic rod and a rubber limiting block, and the situation that due to the fact that the limiting block is too rigid, the outer surface wall of the wafer is abraded, and the cutting quality of the wafer is affected is avoided; then under the action of a fixing block, a second telescopic rod and a bearing disc, the bottom of the clamped wafer can be supported, aft