Optical chip package
The utility model provides an optical chip package. The optical chip package comprises an optical chip; the light source assembly is arranged above the optical chip; and the light emitted by the light source assembly is diffused, reflected and condensed by the light adjusting assembly and then enter...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model provides an optical chip package. The optical chip package comprises an optical chip; the light source assembly is arranged above the optical chip; and the light emitted by the light source assembly is diffused, reflected and condensed by the light adjusting assembly and then enters the optical chip. The advantages of the utility model are that the light enters the chip after being condensed, so that the loss of optical signals can be effectively reduced; the light direction can be adjusted through the lens and the reflector, so that the assembly difficulty can be reduced, and the yield can be improved; the light source assembly is arranged above the optical chip, so that the size of the product is reduced.
本申请提供了一种光芯片封装,其包括光芯片;光源组件,设置于所述光芯片上方;光线调整组件,所述光源组件发出的光线经所述光线调整组件扩散、反射并聚光后射入所述光芯片。本申请的优点在于:光线经过聚光后进入芯片,能够有效降低光信号的损失;光线方向能够通过透镜和反射镜进行调整,能够降低组装难度,提高良品率;光源组件设置在光芯片上方,有利于缩小产品尺寸。 |
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