Film type MEMS probe card

The utility model discloses a film type MEMS probe card comprising a PCB and a cushion block, and the cushion block is installed on the PCB. A layer of insulating film covers the cushion block, and a circuit structure is arranged on the surface of the insulating film; a boss is arranged in the middle of the cushion block, and the middle area of the insulating film is attached to the boss. The MEMS needle is welded in the middle area of the insulating film, the peripheral area of the insulating film is connected with the PCB through the jumper wire, namely, the MEMS needle is located on the boss, and a height difference exists between the MEMS needle and a welding point of the jumper wire. According to the utility model, the boss structure is arranged on the cushion block, so that the height of the MEMS needle is increased, the height of the jumper wire is reduced, the safety performance of the probe card is higher, and when the probe card is connected with a wafer, the jumper wire is not contacted with the wa