Taking and placing device for gallium arsenide wafer

The utility model discloses a picking and placing device for gallium arsenide wafers, which relates to the technical field of gallium arsenide wafer processing and comprises a supporting plate, a polishing mechanism is arranged at the top of the supporting plate, transmission mechanisms are symmetri...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YUAN XUFEI, XU ZIJUN, LEE KI-YOUNG, LAN SHAODONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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